Definition
Hybrid bonding is a fine-pitch semiconductor bonding technology that joins dielectric surfaces and embedded metal interconnects to create both mechanical bonding and electrical connections at very small pitch.
Application
It enables dense die-to-die and wafer-to-wafer interconnects for heterogeneous integration, chiplets, stacked memory, image sensors, and other advanced packages.
Related search terms
DBI® (Adeia proprietary hybrid-bonding implementation)
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Related concepts
Evidence and further reading
- Evidence from adeia.comhttps://adeia.com/semiconductor/direct-bond-interconnect
- Evidence from imec-int.comhttps://www.imec-int.com/en/press/imec-demonstrates-die-wafer-hybrid-bonding-cu-interconnect-pad-pitch-2mm