Definition
A process that physically joins two or more wafers, either permanently or temporarily.
Application
Used for three-dimensional chip integration and for attaching wafers to supporting carriers during thinning and other processing.
Related concepts
Evidence and further reading
- Evidence from semi.orghttps://www.semi.org/sites/semi.org/files/2023-12/CompilationTerms1023.pdf
- Evidence from evgroup.comhttps://www.evgroup.com/products/bonding/