Definition
Direct bonding applied at wafer scale, in which two cleaned and prepared wafer surfaces are contacted to form an initial bond that is strengthened by surface activation and/or subsequent thermal treatment without a thick adhesive layer.
Application
Used for silicon-on-insulator and other engineered substrates, layer transfer, image sensors and wafer-level 3D integration; cleaning, plasma activation, surface flatness, particle control and wafer alignment are tightly controlled to obtain low-void, high-strength bonds.
Related search terms
Fusion wafer bonding; molecular wafer bonding
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Related concepts
Evidence and further reading
- Evidence from evgroup.comhttps://www.evgroup.com/products/bonding/fusion-and-hybrid-bonding-systems/evg850-lt
- Evidence from evgroup.comhttps://www.evgroup.com/products/bonding/fusion-and-hybrid-bonding-systems