Wafer-to-Wafer Bonding

Definition

Joining two wafers at facing surfaces, directly or through an intermediate bonding layer.

Application

Used for 3D device integration and for attaching device wafers to carrier wafers during thinning and backside processing.

Related concepts

• Wafer Bonding
• Hybrid Bonding
• Die-to-Wafer Bonding
• Wafer Thinning

Evidence and further reading

• Evidence from evgroup.comhttps://www.evgroup.com/products/bonding/
• Evidence from imec-int.comhttps://www.imec-int.com/en/articles/wafer-wafer-hybrid-bonding-pushing-boundaries-400nm-interconnect-pitch