Definition
Reduction of wafer thickness by removing material, for example through grinding, polishing, etching, or combinations of these processes.
Application
Prepares thin dies for stacked packages and thinned wafers for three-dimensional interconnections.
Related concepts
Evidence and further reading
- Evidence from disco.co.jphttps://www.disco.co.jp/eg/solution/library/grinding.html
- Evidence from enas.fraunhofer.dehttps://www.enas.fraunhofer.de/en/departments/SP/research/3d-mems-packaging/waferthinning.html