Definition
Mechanical removal of material from the backside of a semiconductor wafer to reduce wafer thickness before subsequent packaging, singulation, backside processing or TSV reveal steps.
Application
Used to produce thin dies and packages, prepare wafers for stacking, and thin substrates enough to expose TSVs or enable backside power/contact processing.
Related search terms
Backgrinding; wafer backgrinding
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Related concepts
Evidence and further reading
- Evidence from imec-int.comhttps://www.imec-int.com/en/articles/how-power-chips-backside
- Evidence from amkor.comhttps://amkor.com/technology/3d-stacked-die/