Definition
An etch performed from the back surface of a wafer or die to remove substrate material or create backside openings, cavities, membranes, contacts or other structures.
Application
Used in MEMS bulk micromachining, backside contacting and advanced logic flows after wafer thinning, where dry or wet etch steps expose or define structures from the substrate backside.
Related search terms
Back-side etch; backside silicon etch
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Related concepts
Evidence and further reading
- Evidence from nist.govhttps://www.nist.gov/publications/users-guide-rm-8096-and-8097-mems-5-1-2013-edition
- Evidence from imec-int.comhttps://www.imec-int.com/en/articles/advancing-cfet-based-device-roadmap-novel-integration-modules-and-standard-cell