Definition
A conductive vertical connection formed from the wafer backside to reach frontside, buried or device-level interconnect structures after the substrate has been thinned and patterned.
Application
Used in backside power and advanced 3D integration to connect backside metal layers to buried power rails, frontside metal or device contacts; nanoscale backside implementations may use nTSVs.
Related search terms
Backside vertical interconnect; nTSV (specific nanoscale implementation)
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from imec-int.comhttps://www.imec-int.com/en/articles/imec-demonstrates-critical-building-blocks-backside-power-delivery-network
- Evidence from imec-int.comhttps://www.imec-int.com/en/articles/how-power-chips-backside