Definition
In its completed electrical-interconnect form, a conductive path passing through the silicon of a die or silicon carrier.
Application
Used for electrical interconnection of stacked dies and silicon-carrier-based packages.
Related concepts
Evidence and further reading
- Evidence from research.ibm.comhttps://research.ibm.com/publications/cmos-compatible-through-silicon-vias-for-3d-process-integration
- Evidence from semiconductor.samsung.comhttps://semiconductor.samsung.com/support/tools-resources/dictionary/semiconductor-glossary-tsv/