Definition
In its completed electrical-interconnect form, a conductive via extending through a glass substrate.
Application
Used to carry connections through glass interposers for semiconductor packaging and, in some implementations, to form vertical sections of RF inductors.
Related concepts
Evidence and further reading
- Evidence from corning.comhttps://www.corning.com/content/dam/corning/media/worldwide/cdt/documents/IMAPs_Corning_TGV_FINAL.pdf
- Evidence from agc.comhttps://www.agc.com/en/products/electoric/detail/tgv.html