Definition
An advanced-packaging interposer that uses glass as the substrate and may incorporate through-glass vias and redistribution wiring for vertical and lateral interconnection.
Application
Used in 2.5D/3D integration, RF, photonics, MEMS, and high-density packaging where glass dielectric, dimensional, or large-area properties are advantageous.
Related concepts
Evidence and further reading
- Evidence from izm.fraunhofer.dehttps://www.izm.fraunhofer.de/en/abteilungen/wafer-level-system-integration/leistungsangebot/TGV_integration.html
- Evidence from izm.fraunhofer.dehttps://www.izm.fraunhofer.de/en/abteilungen/wafer-level-system-integration/leistungsangebot/interposer.html