Definition
An interposer is an intermediate substrate or routing layer placed between one or more dies and the package substrate to provide dense electrical interconnection and redistribution.
Application
2.5D and chiplet packages use silicon or other interposers to connect logic dies, HBM stacks, and package I/O with finer routing density than conventional package substrates.
Related search terms
silicon interposer; package interposer
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Related concepts
Evidence and further reading
- Evidence from 3dfabric.tsmc.comhttps://3dfabric.tsmc.com/english/dedicatedFoundry/technology/cowos.htm
- Evidence from imec-int.comhttps://www.imec-int.com/en/press/nanoic-opens-access-first-ever-fine-pitch-rdl-and-d2w-hybrid-bonding-interconnect-pdks