Interconnect Pitch

10 BEOL Interconnect & Metallization

Definition

Interconnect pitch is the center-to-center spacing between adjacent repeated interconnect lines or features in a wiring level.

Application

Pitch is a key BEOL scaling metric because shrinking it increases wiring density while tightening requirements on patterning, line resistance, spacing, dielectric integration, and process variability.

Related search terms

metal pitch; wiring pitch

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Related concepts

Evidence and further reading

  • Evidence from imec-int.comhttps://www.imec-int.com/en/press/imec-demonstrates-16nm-pitch-ru-lines-record-low-resistance-obtained-using-semi-damascene
  • Evidence from imec-int.comhttps://www.imec-int.com/en/articles/imec-demonstrates-semi-damascene-interconnects-fully-self-aligned-vias-18nm-metal-pitch