BEOL Interconnect & Metallization
Browse 50 glossary entries in BEOL Interconnect & Metallization. Open a term for its definition, application, related concepts and evidence.
50 entries
- Air Gap
- Aluminum Interconnect
- Back End of Line
- Barrier Layer
- Barrier Metal
- Contact
- Contact Chain
- Contact Plug
- Contact Resistance
- Copper
- Copper Barrier
- Copper Damascene
- Copper Electroplating
- Copper Interconnect
- Coupling Capacitance
- Crosstalk
- Damascene
- Dielectric Constant
- Dual Damascene
- Electrochemical Deposition
- Electromigration
- Interconnect
- Interconnect Pitch
- Interlayer Dielectric
- Intermetal Dielectric
- Kelvin Contact
- Line Resistance
- Low-k Dielectric
- Metal Insulator Metal
- Metal Pitch
- Metallization
- Middle of Line
- RC Delay
- Redistribution Layer
- Ruthenium Interconnect
- Seed Layer
- Self-Aligned Via
- Semi-Damascene
- Single Damascene
- Specific Contact Resistivity
- Stress Migration
- Superfill
- Tantalum Nitride
- Time-Dependent Dielectric Breakdown
- Titanium Nitride
- Tungsten
- Tungsten Plug
- Ultra-Low-k Dielectric
- Via
- Via Resistance
Continue learning with PTI
Related PTI training covers the following parts of this topic. See each course outline for its scope.
- Advanced Copper Interconnect Technology
Copper interconnect integration, liners, seeds, plating, CMP and reliability.