Definition
Diffusive mass transport driven by mechanical-stress gradients.
Application
Evaluated in metal-interconnect reliability because it can create voids that cause wiring failure.
Related concepts
Evidence and further reading
- Evidence from cambridge.orghttps://www.cambridge.org/core/books/abs/electronic-thinfilm-reliability/stress-migration-in-thin-films/921E54AB7AA8AB10BAE1773538AC6815
- Evidence from docs.lib.purdue.eduhttps://docs.lib.purdue.edu/dissertations/AAI3291218/