Definition
The current-density-driven transport of metal atoms in an interconnect over time, which can produce voids, material accumulation and eventual resistance increase or open-circuit failure.
Application
Used in interconnect reliability design and qualification to set current-density limits and optimize metal, liner, cap, via and layout choices for required operating lifetime.
Related search terms
Interconnect electromigration; metal electromigration
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Related concepts
Evidence and further reading
- Evidence from research.ibm.comhttps://research.ibm.com/publications/electromigration-challenges-for-advanced-on-chip-cu-interconnects
- Evidence from research.ibm.comhttps://research.ibm.com/publications/mechanisms-of-electromigration-damage-in-cu-interconnects