Definition
Center-to-center spacing between adjacent metal interconnect lines, normally qualified by routing layer or process level.
Application
Used as an interconnect-scaling metric; reducing metal pitch increases routing density while tightening resistance, capacitance, patterning, and integration constraints.
Related search terms
interconnect metal pitch; wiring pitch
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Related concepts
Evidence and further reading
- Evidence from semiengineering.comhttps://semiengineering.com/breaking-the-2nm-barrier/
- Evidence from imec-int.comhttps://www.imec-int.com/en/press/imec-demonstrates-16nm-pitch-ru-lines-record-low-resistance-obtained-using-semi-damascene