Fine-Pitch Interconnect

Definition

A fine-pitch interconnect is a high-density electrical connection scheme in which adjacent interconnect features, pads, bumps, redistribution lines, or bonds are spaced at a small pitch to increase I/O density and shorten chip-to-chip or die-to-package connections.

Application

Advanced packaging uses fine-pitch redistribution and bonding to connect chiplets and dies at higher density, reducing interconnect length and enabling high-bandwidth, energy-efficient heterogeneous integration.

Related concepts

• Interconnect Pitch
• Redistribution Layer
• Hybrid Bonding

Evidence and further reading

• Evidence from imec-int.comhttps://www.imec-int.com/en/press/nanoic-opens-access-first-ever-fine-pitch-rdl-and-d2w-hybrid-bonding-interconnect-pdks
• Evidence from amkor.comhttps://amkor.com/technology/s-swift/