Redistribution Layer

Definition

A patterned metal routing layer, commonly copper within package dielectric, used to reroute die input/output connections from original pad locations to new connection locations or pitches.

Application

Used in wafer-level, fan-out, and advanced packaging to fan out die pads, connect bumps or package substrates, and support multi-die integration.

Related concepts

• Interconnect
• Fine-Pitch Interconnect
• Copper
• Package Substrate

Evidence and further reading

• Evidence from amkor.comhttps://amkor.com/packaging/wafer-level-packaging/wlcsp/
• Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/press-room/device-technology-of-the-year/