Definition
A package substrate is the circuit-bearing foundation inside a semiconductor package that supports attached die and routes electrical signals between the die and external package or board connections.
Application
Used for die attachment, high-density interconnection, signal and power routing, and mechanical support in semiconductor packaging.
Related concepts
Evidence and further reading
- Evidence from sem.samsung.comhttps://sem.samsung.com/global/product/substrate/package-substrate.do
- Evidence from intel.comhttps://www.intel.com/content/www/us/en/newsroom/tech101/explaining-common-chip-terms.html