Organic Substrate

14 Packaging, Assembly, Chiplets & 3D Integration

Definition

An organic substrate is a semiconductor package substrate made from organic laminate material that mechanically supports attached die and provides package-level electrical routing.

Application

Used as the package carrier/foundation for die attachment and interconnection routing between the semiconductor die or chiplets and the package or system board.

Related concepts

Evidence and further reading

  • Evidence from intel.comhttps://www.intel.com/content/www/us/en/newsroom/tech101/explaining-common-chip-terms.html
  • Evidence from calumetelectronics.comhttps://www.calumetelectronics.com/calumet-electronics-opens-the-nations-first-dedicated-panel-level-organic-substrate-facility-closing-a-critical-gap-in-americas-semiconductor-supply-chain/