Definition
A highly conductive metallic element used extensively in semiconductor interconnect and packaging because it offers lower electrical resistivity than aluminum and supports high-current-density wiring when properly integrated.
Application
Used in BEOL lines and vias, electroplated damascene structures, package redistribution layers, copper pillars, TSVs and hybrid-bonding pads. Copper requires compatible barrier, seed, CMP and contamination-control processes.
Related search terms
Copper metallization
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Related concepts
Evidence and further reading
- Evidence from lamresearch.comhttps://www.lamresearch.com/product/sabre/
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-demonstrates-complete-copper-interconnect