Definition
A thin film surrounding or underlying copper interconnect structures that suppresses copper diffusion into adjacent dielectrics and helps maintain reliable interfaces.
Application
Used in copper damascene and bonding structures before seed and bulk copper deposition. Tantalum, tantalum nitride and newer barrier/liner materials are used because uncontrolled copper diffusion can degrade dielectric integrity and reliability.
Related search terms
Copper diffusion barrier; Cu barrier
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Related concepts
Evidence and further reading
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/fujitsu-selects-applied-materials-electroplating-system-build
- Evidence from imec-int.comhttps://www.imec-int.com/en/articles/view-logic-technology-roadmap