Definition
An inlaid copper interconnect process in which trenches and/or vias are patterned into dielectric material, lined with barrier and seed layers, filled with copper, and then planarized by CMP so copper remains only in the patterned features.
Application
Used to fabricate copper BEOL wiring without subtractively etching bulk copper. Single- and dual-damascene schemes form dense interconnect lines and vias with controlled resistance and geometry.
Related search terms
Cu damascene; damascene copper interconnect
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Related concepts
Evidence and further reading
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-demonstrates-complete-copper-interconnect
- Evidence from lamresearch.comhttps://www.lamresearch.com/product/sabre/