Definition
A CMP process optimized to remove excess copper and associated barrier films after copper fill while leaving the intended inlaid copper lines or vias planar with the surrounding dielectric.
Application
Used as a key step in copper damascene and advanced packaging flows to remove overburden, control dishing and erosion, achieve planarity, and prepare the wafer for subsequent interconnect layers or bonding.
Related search terms
Copper chemical mechanical planarization
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Related concepts
Evidence and further reading
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-solves-critical-copper-challenges-new-mirra
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/products/shape/cmp.html