Definition
The ratio of CMP material-removal rates for two different films or materials under the same polishing conditions.
Application
Used to design and control CMP processes so the target film is removed at the desired rate while an underlying, adjacent or stop material is removed more slowly, helping manage dishing, erosion and endpoint margin.
Related search terms
CMP removal selectivity; polish selectivity
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Related concepts
Evidence and further reading
- Evidence from entegris.comhttps://www.entegris.com/en/home/our-science/by-industry/microelectronics/semiconductor/cmp.html
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/products/shape/cmp.html