Definition
Rate at which material is removed from a wafer or film under specified process conditions, commonly expressed as thickness removed per unit time in CMP.
Application
Used to characterize and control CMP throughput, endpoint planning, uniformity, and process optimization across wafer materials and polishing conditions.
Related search terms
removal rate
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Related concepts
Evidence and further reading
- Evidence from nist.govhttps://www.nist.gov/publications/physics-informed-multi-task-learning-material-removal-rate-prediction-semiconductor
- Evidence from itl.nist.govhttps://www.itl.nist.gov/div898/handbook/ppc/section4/ppc432.htm