Definition
A formulated liquid used in CMP that contains abrasive particles and reactive chemical components selected to promote controlled removal of the wafer material being polished.
Application
Used with the CMP pad to remove and planarize copper, tungsten, oxide and other films; slurry particle size, chemistry, concentration and filtration strongly influence removal rate, selectivity, surface finish and defects.
Related search terms
Polishing slurry; CMP polishing slurry
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from entegris.comhttps://www.entegris.com/en/home/our-science/by-industry/microelectronics/semiconductor/cmp.html
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/products/shape/cmp.html