Definition
A wafer planarization process that combines chemically assisted surface reactions with mechanical polishing by a pad and slurry to remove material and produce a flatter, more uniform surface.
Application
Used repeatedly in logic, memory and advanced packaging to planarize dielectrics, metals and other films, enabling subsequent lithography and multilayer integration while controlling thickness and within-wafer uniformity.
Related search terms
Chemical mechanical polishing (common synonym)
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Related concepts
Evidence and further reading
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/products/shape.html
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/product-library/opta-cmp.html