Definition
Post-CMP clean is the cleaning step performed after chemical mechanical planarization to remove particles, organic residues, metallic contaminants, and other polishing-related contamination from the wafer.
Application
Used after CMP to remove residual particles and residues while controlling corrosion, water marks, and other cleaning-induced surface defects before downstream processing.
Related search terms
Post-CMP cleaning; After-CMP clean
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from horiba.comhttps://www.horiba.com/int/semiconductor/process/chemical-mechanical-planarization-cmp/
- Evidence from entegris.comhttps://www.entegris.com/en/home/our-science/by-industry/microelectronics/semiconductor/cmp.html