Wet Processing, Cleaning & CMP
Browse 33 glossary entries in Wet Processing, Cleaning & CMP. Open a term for its definition, application, related concepts and evidence.
33 entries
- Batch Cleaning
- Brush Scrubbing
- Buffered Oxide Etch
- Chemical Mechanical Planarization
- Chemical Mechanical Planarization Defect
- CMP Pad
- CMP Scratch
- CMP Selectivity
- CMP Slurry
- Contact Angle
- Copper CMP
- Copper Recess
- Dishing
- Erosion
- Galvanic Corrosion
- Hydrofluoric Acid
- KOH Etch
- Material Removal Rate
- Megasonic Cleaning
- Native Oxide
- Pad Conditioning
- Piranha Clean
- Post-CMP Clean
- RCA Clean
- SC-1 Clean
- SC-2 Clean
- Single-Wafer Cleaning
- Surface Energy
- Surfactant
- Tungsten CMP
- Wet Bench
- Within-Wafer Nonuniformity
- Zeta Potential
Continue learning with PTI
Related PTI training covers the following parts of this topic. See each course outline for its scope.
- Fundamentals of Chemical Mechanical Planarization (CMP)
CMP tools, pads, slurries, metal and dielectric polishing, and post-CMP cleaning.
- Wet Semiconductor Processing (Wet Etch & Clean, Electroplating, & CMP Slurries)
Surface conditioning, wet cleaning, resist removal and post-CMP cleaning.