Definition
Chemical-mechanical polishing of tungsten on a wafer, combining chemical surface reactions and mechanical abrasion to remove material and planarize the surface.
Application
Removes excess tungsten after contact or via filling so the remaining tungsten forms plugs in the dielectric.
Related search terms
Tungsten Chemical-Mechanical Polishing; Tungsten Chemical-Mechanical Planarization
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Related concepts
Evidence and further reading
- Evidence from patents.google.comhttps://patents.google.com/patent/US5916855A/en
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-introduces-tungsten-planarization-technology/