Definition
Spatial variation of a measured process result, such as film thickness or material-removal rate, across a single wafer.
Application
Used to compare semiconductor processes and monitor chemical mechanical planarization performance from measurements at multiple wafer locations.
Related concepts
Evidence and further reading
- Evidence from researchgate.nethttps://www.researchgate.net/publication/3804893_A_study_of_within-wafer_non-uniformity_metrics
- Evidence from telf.comhttps://www.telf.com/~roland/Publications/1996-cpmt.pdf