Definition
The engineered polymeric surface that contacts the wafer during chemical mechanical planarization and provides the mechanical component of material removal while carrying slurry across the wafer.
Application
Used with CMP slurry and controlled downforce to planarize metal and dielectric films; pad texture, stiffness, conditioning and wear influence removal rate, uniformity, selectivity and defect generation.
Related search terms
Polishing pad; CMP polishing pad
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Related concepts
Evidence and further reading
- Evidence from entegris.comhttps://www.entegris.com/en/home/our-science/by-industry/microelectronics/semiconductor/cmp.html
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/products/shape/cmp.html