Definition
An unwanted physical, topographic or contamination-related defect created, exposed or left by a CMP step, including scratches, particles, slurry residue, excessive dishing, erosion or related surface damage.
Application
Monitored after CMP because these defects can alter interconnect geometry, bonding surfaces, leakage, reliability and yield; process control and post-CMP cleaning are used to minimize and classify them.
Related search terms
CMP process defect; polishing defect
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Related concepts
Evidence and further reading
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/newsroom/blogs/accelerating-defect-inspection-for-more-reliable-automotive-chip.html
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-announces-advanced-copper-cmp-processes-new