Definition
A chemical-mechanical-planarization nonuniformity in which a polished feature, especially a relatively soft or rapidly removed metal line or pad, becomes recessed below the surrounding surface.
Application
Controlled in copper interconnect and hybrid-bond CMP because excessive recess changes metal thickness and resistance and can create topography or bond-interface voids; pad, slurry, pressure, selectivity, pattern density and endpoint/overpolish affect dishing.
Related search terms
CMP dishing; copper dishing
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Related concepts
Evidence and further reading
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-advances-heterogeneous-chip-integration-new
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-solves-critical-copper-challenges-new-mirra