Definition
A chemical-mechanical-planarization nonuniformity in which a patterned region—especially a dense array of metal features and surrounding dielectric—is recessed or thinned relative to a neighboring field or lower-density region.
Application
Monitored and minimized in CMP because pattern-density-dependent erosion can reduce dielectric or interconnect thickness, change topography and electrical characteristics, and complicate subsequent lithography and interconnect processing.
Related search terms
CMP erosion; pattern-density erosion
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Related concepts
Evidence and further reading
- Evidence from patents.google.comhttps://patents.google.com/patent/US6919276B2/en
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/products/shape/cmp.html