Contact Angle

08 Wet Processing, Cleaning & CMP

Notation θ

Definition

The angle formed at the three-phase boundary where a liquid droplet, solid surface and surrounding gas meet; it is commonly used as a measure of surface wettability.

Application

Used in semiconductor wet processing and surface preparation to assess hydrophilic or hydrophobic surface condition, oxide removal, cleaning performance and contamination; changes in water contact angle can indicate changes in silicon surface chemistry.

Related search terms

Water contact angle; wetting angle

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Related concepts

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