Definition
A wafer-cleaning method that uses rotating or moving polymer brushes together with deionized water or cleaning chemistry to mechanically assist removal of particles and residues from a wafer surface.
Application
Used for post-process and backside wafer cleaning when particle removal benefits from gentle physical contact, often combined with chemical cleaning or rinsing in single-wafer cleaning systems.
Related search terms
Wafer brush cleaning; brush scrubber cleaning
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Related concepts
Evidence and further reading
- Evidence from screen.co.jphttps://www.screen.co.jp/en/news/NR201208-2E
- Evidence from screen.co.jphttps://www.screen.co.jp/spe/technical/guide/cleanprocess