Buffered Oxide Etch

08 Wet Processing, Cleaning & CMP

Notation BOE

Definition

A wet silicon-oxide etchant based on hydrofluoric acid buffered with a fluoride salt, commonly ammonium fluoride, to provide controlled and more stable oxide-etch behavior.

Application

Used to remove or pattern silicon oxide, including native or deposited oxide films, in wet benches before subsequent fabrication steps while maintaining a controlled etch chemistry.

Related search terms

Buffered HF; buffered hydrofluoric acid etch

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Related concepts

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