Definition
An inlaid interconnect fabrication flow in which trenches and/or vias are patterned in dielectric, filled with conductive metal, and then planarized so metal remains in the recessed features.
Application
Widely used for copper BEOL wiring because copper is difficult to pattern by conventional subtractive etch. Single- and dual-damascene flows combine dielectric patterning, barrier/seed formation, copper fill and CMP.
Related search terms
Damascene process; inlaid metallization
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Related concepts
Evidence and further reading
- Evidence from newsroom.lamresearch.comhttps://newsroom.lamresearch.com/A-Deposition-and-Etch-Technique-to-Lower-Resistance-of-Semiconductor-Metal-Lines
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-demonstrates-complete-copper-interconnect