Definition
A damascene interconnect flow in which both a via and its connected wiring trench are patterned in dielectric and then filled together with metal, most commonly copper, before planarization.
Application
Used in BEOL copper interconnect fabrication to form vertical vias and horizontal lines in an integrated sequence that includes dielectric patterning, barrier/liner and seed deposition, electrochemical copper fill and CMP.
Related search terms
Dual-damascene interconnect; dual damascene copper
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Related concepts
Evidence and further reading
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/static-files/fb8a1b4a-210a-4e44-84ff-0c9b336945af
- Evidence from research.ibm.comhttps://research.ibm.com/blog/beol-cu-interconnects-iedm