Definition
An electrochemical deposition process that grows copper onto a conductive seed layer from an electrolyte by driving a controlled current or potential through the wafer and plating bath.
Application
Used to fill damascene trenches, vias, TSVs and package features with low-resistivity copper. Process chemistry and waveform control are engineered to obtain void-free bottom-up fill, uniform thickness and low defectivity.
Related search terms
Copper ECD; copper electrochemical deposition
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Related concepts
Evidence and further reading
- Evidence from lamresearch.comhttps://www.lamresearch.com/product/sabre/
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-demonstrates-complete-copper-interconnect