Definition
A deposition process in which an applied electrical current drives electrochemical reduction of dissolved metal ions so that metal plates onto a conductive or seeded wafer surface.
Application
Used to fill copper damascene features and advanced-packaging interconnect structures with low-resistance metal; process control targets void-free fill, low defectivity, thickness uniformity and high productivity.
Related search terms
Electrodeposition; electroplating; electrochemical plating
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Related concepts
Evidence and further reading
- Evidence from lamresearch.comhttps://www.lamresearch.com/product/sabre/
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/static-files/fb8a1b4a-210a-4e44-84ff-0c9b336945af