Definition
A thin deposited film that promotes the initiation of a subsequent deposition process.
Application
In copper interconnect fabrication, provides a nucleation surface and helps distribute current during copper electroplating.
Related search terms
nucleation layer
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Related concepts
Evidence and further reading
- Evidence from lamresearch.comhttps://www.lamresearch.com/technical-glossary/
- Evidence from tsapps.nist.govhttps://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=853255