Definition
A bonding method that forms a direct metallurgical connection between opposing copper pads or surfaces on two dies or wafers without a conventional solder joint.
Application
Used in fine-pitch 3D and hybrid-bonded integration to achieve very dense vertical electrical connections with low parasitic resistance and capacitance. In hybrid bonding it occurs together with dielectric-to-dielectric bonding after surface preparation, alignment and anneal.
Related search terms
Direct copper bonding; copper-to-copper bonding
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Related concepts
Evidence and further reading
- Evidence from imec-int.comhttps://www.imec-int.com/en/articles/wafer-wafer-hybrid-bonding-pushing-boundaries-400nm-interconnect-pitch
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/markets-and-inflections/heterogeneous-integration/hybrid-bonding.html