Definition
An interconnect via whose boundary is constrained to a metal line in at least one direction by process-defined features, for example by selectively removing silicon nitride to confine the opening to a lower metal line.
Application
Used to reduce via-to-line misalignment and associated leakage risk when connecting narrow BEOL metal lines.
Related concepts
Evidence and further reading
- Evidence from imec-int.comhttps://www.imec-int.com/en/articles/imec-demonstrates-semi-damascene-interconnects-fully-self-aligned-vias-18nm-metal-pitch
- Evidence from research.ibm.comhttps://research.ibm.com/publications/process-challenges-in-fully-aligned-via-integration-for-sub-32-nm-pitch-beol