Definition
A BEOL interconnect integration scheme that fills and overfills vias patterned in dielectric, then subtractively etches the overlying metal into interconnect lines.
Application
Investigated for tightly pitched local interconnects, including ruthenium wiring, to manage line resistance and capacitance while avoiding metal CMP.
Related search terms
semi-damascene integration
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Related concepts
Evidence and further reading
- Evidence from imec-int.comhttps://www.imec-int.com/en/articles/imec-demonstrates-semi-damascene-interconnects-fully-self-aligned-vias-18nm-metal-pitch
- Evidence from imec-int.comhttps://www.imec-int.com/en/imec-magazine/imec-magazine-september-2019/scaling-the-beol-a-toolbox-filled-with-new-processes-boosters-and-conductors