Definition
A damascene interconnect process that patterns and fills one feature level, such as vias or wiring trenches, then planarizes it; via and line levels are formed in separate sequences.
Application
Used to form embedded metal vias and wiring levels in multilevel integrated-circuit interconnects, including copper interconnects.
Related search terms
single-damascene process
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Related concepts
Evidence and further reading
- Evidence from iue.tuwien.ac.athttps://www.iue.tuwien.ac.at/phd/holzer/node43.html
- Evidence from catalogimages.wiley.comhttps://catalogimages.wiley.com/images/db/pdf/9780471780465.excerpt.pdf