Definition
Interconnect insulating material with a dielectric constant lower than conventional silicon dioxide, used to reduce parasitic capacitance between conductors.
Application
Used in BEOL interconnect stacks to reduce RC delay, crosstalk, and dynamic power as metal spacing shrinks.
Related search terms
low-k material; low-k dielectric
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Related concepts
Evidence and further reading
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-launches-industrys-broadest-300mm-product-line
- Evidence from ir.appliedmaterials.comhttps://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-black-diamond-low-k-wins-best-product-award/